JPH0530063B2 - - Google Patents

Info

Publication number
JPH0530063B2
JPH0530063B2 JP58163037A JP16303783A JPH0530063B2 JP H0530063 B2 JPH0530063 B2 JP H0530063B2 JP 58163037 A JP58163037 A JP 58163037A JP 16303783 A JP16303783 A JP 16303783A JP H0530063 B2 JPH0530063 B2 JP H0530063B2
Authority
JP
Japan
Prior art keywords
wafer
semiconductor wafer
peripheral edge
semiconductor
placement section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58163037A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6054449A (ja
Inventor
Tooru Watanabe
Isahiro Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15765980&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0530063(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP16303783A priority Critical patent/JPS6054449A/ja
Publication of JPS6054449A publication Critical patent/JPS6054449A/ja
Publication of JPH0530063B2 publication Critical patent/JPH0530063B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
JP16303783A 1983-09-05 1983-09-05 半導体ウエハ搬送治具 Granted JPS6054449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16303783A JPS6054449A (ja) 1983-09-05 1983-09-05 半導体ウエハ搬送治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16303783A JPS6054449A (ja) 1983-09-05 1983-09-05 半導体ウエハ搬送治具

Publications (2)

Publication Number Publication Date
JPS6054449A JPS6054449A (ja) 1985-03-28
JPH0530063B2 true JPH0530063B2 (en]) 1993-05-07

Family

ID=15765980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16303783A Granted JPS6054449A (ja) 1983-09-05 1983-09-05 半導体ウエハ搬送治具

Country Status (1)

Country Link
JP (1) JPS6054449A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0555891B1 (en) * 1985-10-24 1999-01-20 Texas Instruments Incorporated Vacuum processing system and method
JPH0713217Y2 (ja) * 1988-09-24 1995-03-29 株式会社リコー 半導体製造装置の下部電極
JP3107310B2 (ja) * 1988-11-30 2000-11-06 東京エレクトロン株式会社 処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54103034A (en) * 1978-01-30 1979-08-14 Matsushita Electric Ind Co Ltd Automatic developer
US4433951A (en) * 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock

Also Published As

Publication number Publication date
JPS6054449A (ja) 1985-03-28

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